Recently, good news came from the Science and Technology Bureau of Nansha District. The project “Research and Industrialization of FPC Board Quality Inspection System Based on Industrial Intelligence,” jointly declared by the Institute of Industrial Information and Intelligence (Triple-i Institute) of The Hong Kong University of Science and Technology (Guangzhou), has been successfully approved for support under the 2023 Nansha District Key Areas Science and Technology Plan, in conjunction with the Hong Kong and Macao Science and Technology Tackling Key Problems Initiative.

The project focuses on the current issues with the quality inspection methods for Flexible Printed Circuit (FPC) boards, such as poor adaptability, high false reject rate, and low efficiency of manual re-inspection. It aims to establish convenient and efficient model construction methods for inspection, research defect recognition algorithms that reduce the false reject rate without missing any defects, study intelligent defect recognition methods capable of online learning, and apply the research findings to a testing platform. This platform will evaluate the feasibility of the methods and the effectiveness of the algorithms. Ultimately, the findings will be utilized in production inspection equipment and the related inspection systems will be promoted and applied industrially.

The successful approval of this project not only signifies the recognition of the R&D strength of the Triple-i Institute in the field of industrial intelligence but also marks a solid step forward in promoting the integration of scientific innovation and industrialization. In the future, the project is expected to bring more accurate and efficient quality inspection solutions to Agile (Panyu) Electronics Industrial Co., Ltd. in the field of industrial intelligence, driving technological progress and industrial upgrading in the industry.

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HKUST (Guangzhou) Information Hub